Automation & System Integration

Our extensive experience in developing diverse computer automated equipment for the semiconductor and micro-electronics industries includes the design of OEM production equipment for manufacturers and custom special purpose equipment for R&D and pilot production groups.

Some of the equipment types we have

Die Attach Equipment Mask Aligners Wire Bonders Wafer Probers Inspection Stations Wafer Backside Laser Marker / Aligner Pick & Place / Sorting Equipment Probe Card Alignment Equipment Burn-in Board Loaders Test Handlers UV Exposure Systems Epoxy Pattern Dispenser

been involved with include:

Our system design process includes throughput analysis, motion component optimization, hardware / software tradeoffs, and multi-tasking considerations

Our software design uses object oriented programming (OOP), concurrent processing to optimize throughput and user-friendly graphics to facilitate an intuitive, easy-to-use User Interface.

Automation feature capabilities include positioning control to 0.1 micron resolution utilizing Vision System assistance and integrating various equipment into a cohesive operating unit with a single Operator Interface.

System complexity of past projects include a fully automated assembly line for leadframe chip assembly and a fully automated plate molding system containing over 50 motors and 45 digital actuators.

Examples: Mask Aligner   Wafer Sorter   Backside Laser Marker